Alloy Powder For 3d Printing
Alloy Powder For 3d Printing
keyword:
Alloy Powder For 3d Printing
Product Details
Product Overview
Chengxu Alloy Powder - Sunrise Group
This product series is tailored for SLM metal 3D printing and features low oxygen content, high sphericity, excellent flowability, and robust batch-to-batch consistency, meeting the demands of additive manufacturing for high‑precision, complex‑shaped components. The portfolio includes conventional aluminum powders such as AlSi10Mg and AlSi7Mg, as well as advanced new‑generation alloys like AM6061 and AM5083, addressing industry‑wide challenges associated with traditional aluminum materials—namely, numerous printing defects and an inability to undergo anodization. In addition, it offers copper alloy powders such as CuCrZr and pure copper, which deliver outstanding thermal and electrical conductivity, making them ideal for large‑scale additive manufacturing of aerospace components, 3C electronics, and heat‑dissipation parts in the new‑energy sector.
Product model
01 AISi10Mg/AISi7Mg
|
Production process |
Particle size |
Advantages of the powder |
Application areas |
|
Vacuum atomization method |
15–53 μm |
High sphericity |
Lightweight 3D-printed structural components |
|
20–63 μm |
☆Chemical Composition:
Name |
Project |
Chemical composition |
||||||||||
|
Al |
Yes |
Magnesium |
Fe |
Cu |
Mn |
Ni |
Zn |
Ti |
Pb |
Sn |
||
|
AISi10Mg |
Specification Range |
Bal. |
9.0-11.0 |
0.20-0.45 |
0.55 |
0.05 |
0.45 |
0.05 |
0.10 |
0.15 |
0.05 |
0.05 |
|
Test results |
- |
10.02 |
0.36 |
0.056 |
<0.01 |
<0.01 |
<0.01 |
<0.01 |
0.01 |
<0.03 |
<0.03 |
|
|
AISi7Mg |
Specification Range |
Bal. |
6.5-7.5 |
0.45-0.75 |
0.20 |
0.10 |
0.10 |
0.05 |
0.10 |
0.08-0.25 |
0.05 |
0.05 |
|
Test results |
- |
7.15 |
0.56 |
0.08 |
<0.01 |
<0.01 |
<0.01 |
0.011 |
0.16 |
<0.03 |
<0.03 |
|
☆Product Performance Comparison:
Product Name |
Specifications |
grain Degree (μm) |
Liquidity |
Loose packing density |
Tap density |
Oxygen content |
Mechanical Properties After Powder Printing ( After annealing ) |
||||
|
D10 |
D50 |
D90 |
Yield strength Mpa |
Tensile strength Mpa |
Elongation % |
||||||
|
AISi10Mg |
20-63 |
24.12 |
42 |
67.82 |
90 |
1.54 |
1.73 |
<500 |
≥200 |
≥320 |
≥12 |
|
ASi7Mg |
20-63 |
23.98 |
43.04 |
67.71 |
93 |
1.44 |
1.64 |
<500 |
≥200 |
≥300 |
≥15 |
02 316L stainless steel powder
|
Production process |
Particle size |
Advantages of the powder |
Application areas |
|
Gas atomization |
15–45 μm |
Compared with vacuum atomized powders, it is more cost-effective and offers superior control over sphericity and oxygen content. |
Automotive parts manufacturing |
|
20–53 μm |
☆Chemical Composition:
Elemental content |
C |
Cr |
Ni |
Mo |
Mn |
Yes |
P |
S |
Fe |
|
Content |
≤0.03% |
16-18% |
10-14% |
2-3% |
≤2% |
≤1% |
≤0.045% |
≤0.045% |
Margin |
☆ Printing Performance:
Product Name |
Specifications |
Yield Strength (MPa) |
Tensile strength (MPa) |
Elongation (%) |
|
316L |
15-53um |
200±20 |
500±20 |
≥35 |
03 High-Strength Aluminum Alloy Powder – AlMgMnScZr
Production process |
Particle size |
Advantages of the powder |
Application areas |
|
Vacuum atomization method |
15–53 μm |
High sphericity |
Lightweight 3D-printed structural components |
|
20–63 μm |
☆ Printing Performance:
Product Name |
Unheat-treated |
Heat treatment |
||||
|
Yield Strength Re (MPa) |
Tensile strength Rm (MPa) |
Elongation (%) |
Yield strength Re [MPa] |
Tensile strength Rm (MPa) |
Elongation after fracture A (9%) |
|
|
AM5083 |
>360 |
>400 |
>11 |
>480 |
>500 |
>9 |
04 Anodizable, High‑Thermal‑Conductivity 3D‑Printed Aluminum Alloy Powder – AM6061
Production process |
Particle size |
Advantages of the powder |
Application areas |
|
Vacuum atomization method |
15–53 μm |
Good liquidity |
Automotive 3D printing manufacturing |
|
20–63 μm |
☆ Product Printing Performance:
Product Name |
Unheat-treated |
Heat treatment |
||||
|
Yield strength Re(MPa) |
Tensile strength Rm (MPa) |
Elongation (%) |
Yield strength Re(MPa) |
Tensile strength Rm (MPa) |
Elongation after fracture A(9%) |
|
|
AM6061 |
>175 |
>210 |
≥15 |
>280 |
>310 |
>11 |
☆ Thermal conductivity:
Numbering |
Temperature (℃) |
Thermal conductivity (W/(m·K)) |
|
1 |
25 |
225 |
|
100 |
226 |
|
|
2 |
25 |
200 |
|
100 |
210 |
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